XDI (XRAY Defect Inspection) 

Auto Defect Inspection 

The X-ray defect metrology system for 300mm Si device manufacturers. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XDI) technology. Applications include monitoring edge damage to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, which reduces cycle times and facilitates fab expansion.

Easily Identify Crystalline Defects

Enables its users to identify cracks and other defects in the wafer which can cause catastrophic structural failure, Before the breakage occurs. Once a defect has been observed, non-destructive cross section review images can be performed to locate the defect locations within the wafer depth.